IPD Osstem TSIII 3D analog (incl. screw)
3D analog for digital model fabrication and transfer of the implant position, compatible with Osstem TSIII.
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IPD Osstem TSIII 3D analog (incl. screw)
3D analog for digital model fabrication and transfer of the implant position, compatible with Osstem TSIII.
Description
The component is intended to reproduce the implant position and connection in digitally fabricated, such as 3D-printed, working models. The product is compatible with Osstem TSIII.
Product facts
- Type: Implant analog
- Compatibility: Osstem TSIII
- Use: 3D analog for digital model fabrication and transfer of the implant position
- Design: Designed for digitally fabricated working models
- Screw: Included